PCB Thickness and Composition
Controlling the thickness and composition of layers in PCB devices is important for their durability as well as for soldering or bonding.
Layer Analysis
Bruker offers analytical solutions to investigate PCB layers with EDS (StrataGEM) and micro-XRF (XMethod) techniques.
Where the electron excitation is particularely good for thinner films (up to hundreds of nm) and light elements, micro-XRF can investigate thicker layers and stacks of layers. Both StrataGEM and XMethod can simulaneously determine the mass coverage/thickness and the layers composition of films.
Resources & Publications
- Layer Analysis Brochure
- Application Note XRF 462 - Spatially resolved layer thickness analysis of thin metal coatings
- Application Note XRF 457 - Analyzing thin layers under vacuum
- Application Note EDS-11 - Analysis of the elemental composition and thickness of a Fe-Ni film on Si using Bruker ESPRIT and SAMx STRATAGem